HDD
SSD . M.2
Headset
-8%
Arctic MX 5 Thermal Paste 8 Gram
Original price was: EGP850.00.EGP799.00Current price is: EGP799.00.
Dell Vostro 3515 Laptop, AMD® Ryzen5™ 3450U Processor, 8GB RAM, 256GB SSD HDD, AMD Radeon Graphics, 15.6 Inch HD, Ubuntu, Black
Original price was: EGP23,499.00.EGP23,299.00Current price is: EGP23,299.00.
Arctic MX 5 Thermal Paste 4 Gram
Original price was: EGP650.00.EGP599.00Current price is: EGP599.00.
- Thermal Paste
- 4 Gram
- Non Conductive
| Brands |
ARCTIC |
|---|
في حاله تاكيد الاوردر يرجي التواصل واتس أب عـ الرقم التالي لتاكيده في أسرع وقت
01009858925
01009858925
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Items sold in last 3 minutes
5 in stock
Description
ince the mere thermal conductivity value cannot provide any information about the actual performance, we put our MX-5 up against a broad field of competitors under laboratory conditions. The temperature difference between CPU and cooler base was measured.
How is it tested?
Why are CPUs only conditionally suitable for measuring the performance of thermal paste?
Why are the stated thermal conductivity values of a paste not meaningful?
LOWEST THERMAL RESISTANCE
The surfaces of processor chips and cooler floors are covered with microscopic dents; ARCTIC‘s MX-5 thermal paste is composed of carbon microparticles which fill these cavities. This leads to low thermal resistance, guaranteeing that heat is dissipated efficiently from the CPUs, GPUs or power semiconductor components.
AVAILABLE IN VARIOUS VERSIONS
ARCTIC MX-5 is available in sizes ranging from 2 to 50 grams. Resealable packaging prevents the paste from drying out.
Alternatively, the variants are available with a spatula.
SAFE APPLICATION
In contrast to pastes based on metal oxides or liquid metal, ARCTIC MX-5 is neither electrically conductive nor capacitive. This eliminates the risk of short circuits and discharges, plus you don’t have to worry about corrosion damage to the cooler base caused by liquid metal.
EASY APPLICATION
Thanks to its consistency, MX-5 is easy to apply, even for beginners. The video below demonstrates the application technique to avoid air pockets between processors and coolers.
PRODUCT VIDEO
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